July 2011
ISO Audit
ISO accreditations are renewed together with the other French repair site of Itancia.
6 June 2011
Transfer to Eybens
On Monday 6, our activity is transferred from Seyssinet to Eybens
(still in Grenoble neighborhood) and is planned to restart normally on Tuesday.
Please send your products to our new address.
Phone and email contacts could be disrupted on Monday.
To know our new address...
November 2010
G2S joins ITANCIA group
ITANCIA acquires G2S to reach new markets and boosts G2S opportunities with its strong presence throughout Europe.
Our BCD department is specialized in Surface Mounted Technology (SMT). Here are grouped both equipment and knowledge to replace SMD (and through-hole) components. By the way all kinds of services are provided: board assembly, rework, reballing, repair...
Our main customers for this activity are engineering or production departments in local factories, great companies or european research centers.
The reballing of all types of BGA is possible: package size from 1 mm to 45 mm.
Several ball diameters (beginning with 200 µm) are used in accordance with the specifications of your BGA.
We use the alloy of your choice (with or without lead).
Our LASER technology allows any component to be replaced with nearly 100% yield rate.
The LASER equipment avoids also generally special tool development to unsolder and solder a component on a board.